Beschreibung
The TR7500QE AOI offers high performance 3D solder and assembly inspection by combining the next generation multi-angle 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection and 4 side view cameras. Latest inspection software ensures quick CAD-based programming and features fully customizable templates for zero escapes on any PCBA.
Technische Daten
Optical System | |
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Imaging Method | Stop-and-Go Imaging |
Top Camera | 12 Mpix |
Angle Camera | 6.5 Mpix |
Imaging Resolution | 10 µm, 15 µm (factory setting) |
Lighting | Multi-phase true color LED, Coaxial lighting |
3D Technology | Quad Digital Fringe Projectors |
Max. 3D Range | 12 Mpix@ 10 µm: 0-10 mm 12 Mpix@ 15 µm: 0-20 mm |
Inspection Performance | |
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Imaging Speed |
12 Mpix@ 10 µm: 13.5 cm²/sec Note: Depending on component distribution |
Motion Table & Control | |
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X-Axis Control | Ballscrew + AC-servo controller (Linear motor optional) |
Y-Axis Control | Dual driven ballscrew + AC-servo controller |
Z-Axis Control | Ballscrew + AC-servo controller |
X-Y Axis Resolution | 1 µm |
Board Handling | |
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Max PCB Size | TR7500QE: 510 x 460 mm TR7500L QE: 660 x 610 mm TR7500QE DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 50 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm [5 mm optional] |
Conveyor |
Inline |
Inspection Functions | |
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Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
Solder | Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
Anlagenmerkmale
- Multi-angle 2D + 3D Coverage
- 4-way Digital Fringe Projectors
- 4 Side View Cameras
- Up to 20 mm 3D Height Range
- High Speed CoaXPress Imaging
- Optional 3D Laser Module