- luxless reflow utilizes Formic Acid (CH2O2) vapor to act as a reducing agent to oxides on metal solder, replacing the need for flux.
- Eliminates issues related to residual flux, such as voiding
- Process steps related to flux, such as for pre-reflow fluxing and post-reflow flux cleanup steps are no longer needed, saving time, money, and floor space.
- Heller Industries was the first company to bring continuous operation fluxless reflow to market.