Beschreibung
The TR7600F3D presents a next generation inspection platform for the most demanding PCB design. The inline CT AXI solution combines ultra-high resolution imaging with high definition planar CT inspection, a new robust hardware platform and a redesigned intuitive software to achieve exceptional image quality and reliable inspection results.
Technische Daten
Imaging System | |
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Camera |
7M flat panel detector |
X-ray Source | Microfocus tube 130 kV max (user adjustable) |
Imaging Resolution | 5 μm ,10 μm, 15 μm, 20 μm, 25 μm, 30 μm (3 settings factory configured) |
Inspection Method | 2D, 2.5D, 3D Slicing, Planar CT |
Motion Table & Control | |
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X-Axis Control | High-precision ballscrew + AC-servo controller |
Y-Axis Control | High-precision ballscrew + AC-servo controller |
Z-Axis Control | High-precision ballscrew + AC-servo controller |
X-Y Axis Resolution | 1 µm |
Board Handling | |
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Max PCB Size | 900x460 mm |
PCB Thickness | Max. 7 mm |
Max PCB Weight | 12 kg |
Top Clearance | @ 20/25/30 μm: 50 mm @ 15 μm: 45 mm @ 10 μm: 25 mm @ 5 μm: 5 mm |
Bottom Clearance | @ 30 μm: 65 mm @ 5/10/15/20/25 μm: 70 mm |
Edge Clearance | 3 mm [5 mm optional] |
Conveyor Height | 880 - 920 mm * SMEMA Compatible |
Inspection Functions | |
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Component | Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating |
Solder | Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead |
Dimensions | |
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WxDxH | 1470 x 2110 x 1975 mm Note: not including signal tower, height: 510 mm |
Weight | 3850 kg |
Power Requirement | 200 - 240 VAC single phase, 50/60 Hz, 4 kVA |
Anlagenmerkmale
- High Resolution 3D CT X-Ray Inspection
- True 3D Solder Joint Viewer
- Ultra High Resolution for 0250125mm Chips